Location: Hoboken, NJ
Department: Tomorrow
Reports to: Ting Bu
Position Overview
The Research Scientist will work on the modeling, simulation, and architectural development of
quantum and artificial intelligence (AI) computational structures intended for chip-scale
implementation. This role focuses on translating advanced quantum and AI concepts into
physically realistic, simulation-validated device and system designs suitable for fabrication. It
concentrates on high-fidelity simulation, feasibility analysis, and performance optimization under
practical fabrication constraints. The role serves as a technical bridge between the research
team developing novel quantum/AI architectures and the chip fabrication team responsible for
implementation, ensuring that proposed designs are physically realizable, scalable, and
performance-optimized prior to tape-out.
Duties and Responsibilities
- Develop and simulate quantum and AI-based photonic architectures for on-chip
implementation.
- Translate high-level computational concepts into device-level and system-level
simulation models.
- Perform rigorous electromagnetic and multiphysics simulations to evaluate optical,
nonlinear, and quantum effects.
- Model and simulate quantum photonic circuits and quantum gates under realistic device
conditions.
- Analyze fabrication tolerances and material constraints to assess design robustness.
Optimize photonic device structures for performance, scalability, and manufacturability.
- Collaborate closely with fabrication and packaging teams to ensure simulation models
align with process capabilities.
- Support post-fabrication validation by correlating experimental results with simulation
predictions.
- Document modeling methodologies, simulation results, and architectural trade-offs for
internal and external reporting.
Required Qualifications
Education
- Ph.D. in Physics, Applied Physics, Electrical Engineering, or a closely related discipline.
Technical Background
Strong foundation in Photonics, Quantum optics, Nonlinear optics
Demonstrated experience in simulation of photonic integrated circuits.
Experience modeling and simulating quantum gates or quantum optical systems.
Understanding of semiconductor/TFLN and photonic chip fabrication processes sufficient
to incorporate realistic constraints into simulations.
- Familiarity with chip testing and packaging considerations from a modeling perspective.
Software Proficiency
Lumerical (FDTD, MODE, INTERCONNECT)
Tidy3D
COMSOL Multiphysics
Python
MATLAB